Sony, the manufacturer of camera units that are used in Apple’s iPhone 4S, has introduced an image sensor that will allow iPhones having lesser thickness than the current ones. These tiny image sensors (announced yesterday) are made up of Complementary metal oxide semiconductor and have a back illuminated system that enables a user to snap high quality images of compact size.
You may be wondering what camera has to do with the thickness of a device! Well, in the internal circuitry of an iPhone, the components of the camera are considered to be the thickest pieces of hardware. So, lesser space by camera will lead to decreased thickness of the gadget. In fact, the reason for not changing the form factor of iPhone 4S was the thickness requirement of 8 megapixel camera.
Little more on the sensor:
The image sensor deposits the layered pixel section (that has formations of back illuminated pixels) on the chips that contain the circuitry for processing the signals. Some of the advantages of the sensor are:
- Chip size of the image sensor becomes compact
- Includes built in circuits needed for large scale processing of signals and for producing superior quality images
- As lead processes are utilized for the circuit section, the power consumption is comparatively low and faster speed is delivered
- By utilizing production processes specially meant for producing high quality images, higher image quality of the pixel section can be achieved
Before iPhone 4S came into existence, Sony had nothing to do with Apple. Camera sensors for iPhone 4 and iPhone 3GS were produced by OmniVision. Last year in April, CEO of Sony mistakenly revealed that the company will be manufacturing camera sensors for iPhone 4S, which eventually came out to be true. Let us see what’s in the cards this time!
Source: www.iphone5gfeatures.com